http://www.anandtech.com/gadgets/sho...spx?i=3152&p=6

Idle:
90nm -> 149 Watts
65nm -> 100 Watts

Gameplay:
90nm -> 173 Watts
65mn -> 120 Watts

Zombie/Phantom Charge:
90nm -> 2.3 Watts
65nm -> 2.8 Watts

 

Thank you!

 

Sent the Xbox out yesterday, hoping that it will be here before the holidays...

 

Ok..i'm bitter now...

http://forums.xbox.com/1/15804553/Sh....aspx#15804553

Apparently I have a Zephyr board not the Falcon.
(Even though my Lot # is 735....)

It has 3 flat inductor rings (Zephyr)
3 upright = launch
2 flat = Zephyr

Power Supply is 203W which is Zephyr
175W = Falcon

Even WITH my manufacture date of Sep-17-07

However... ALL is not lost.
It seems to have the new heatsink on the GPU which causes all the problems...so I'm hoping this one will be ok...

 

Just to clarify, the 90nm CPU 360s have a failure rate in excess of 30%. And don't be bitter about having Zephyr. Falcon and the new heatsink have likely reduced that failure rate, but there is no evidence that they have solved it entirely. In fact, the addition of a mere heatpipe and no change in the GPU means it is almost certain that they haven't done so.

As for recommending the Intercooler, no please don't buy that. The Nyko Intercooler draws power directly from the 360s power supply, and it appears not to be very good at it. It doesn't draw very 'clean' power, and several people have gotten scorch marks around the power plug on the back of their 360 while using the Intercooler. The 'good' news? Voided warranties over the use of that device. Avoid at all cost.

 

Oh look something is wrong with the unit i have (wink)(wink)
I may have to return it to the store and exchange it for a new one
(its within my 60 day exchange)

We'll see how this goes

Whether or not the new heatsink helps... its way better than the launch board, but the Zephyrs without the new heatsink still have the problem.
No word yet if it'll fix it. Although I'm guessing it more than likely will.
Its got a new heatsink with heatpipe that the old units don't have.

Its not so much the CPU overheating, its the GPU which is still 80-90nm anyway (even on the Falcon board).

 

This is precisely why I maintain that it will not fix it, not entirely. It will undoubtedly lower the failure rate, but they still haven't addressed the two main causes of the RROD. The GPU and the X-clamps (heatsink retention mechanism).

 

It'll fix it if its able to cool the GPU better.
Which it looks like it should/could (can't say for sure)

Its actually got a heat pipe out to another set of fins to move the heat away from the main heat exchanger.

Yes, the newer 65nm die next year will run cooler etc,
but if the new setup is adequate, it'll 'fix' the problems...
but like you said, we won't know for a while.